Sun. Sep 22nd, 2024

ASML delivers 3rd generation EUV chipmaking tool for 2nm and beyond

By Mar 16, 2024

ASML’s Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes. 

ASML’s Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes. 

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