TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI

TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs. 

TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs.