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Tue. Nov 26th, 2024
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Revolutionary Samsung tech that enables stacking HBM on CPU or GPU arrives this year — SAINT-D HBM scheduled for 2024 rollout, says report

By Jun 17, 2024

Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology. 

Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology. 

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