Mon. Nov 25th, 2024

Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026

By Jun 28, 2024

CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI. 

CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI. 

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