Tue. Nov 26th, 2024

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NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks

By Aug 10, 2024

3D DRAM HBMs with built-in AI processing are slated to deliver a 99% improvement in power efficiency.

3D DRAM HBMs with built-in AI processing are slated to deliver a 99% improvement in power efficiency.

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China now producing its own blank wafers as domestic memory company ramps up 3D NAND production — YMTC consumes 500,000 homegrown wafers per month

Nov 26, 2024

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Intel Battlemage desktop GPUs to launch before end of year, report claims

Nov 26, 2024

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This AMD Black Friday Newegg bundle includes Ryzen 7 5700X3D, MSI B550 Plus motherboard, and 32GB of RAM for only $299

Nov 26, 2024

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New

China now producing its own blank wafers as domestic memory company ramps up 3D NAND production — YMTC consumes 500,000 homegrown wafers per month

New

Intel Battlemage desktop GPUs to launch before end of year, report claims

New

This AMD Black Friday Newegg bundle includes Ryzen 7 5700X3D, MSI B550 Plus motherboard, and 32GB of RAM for only $299

New

AMD granted a glass substrate patent to revolutionize chip package — Intel, Samsung, and others racing to deploy the new tech