Tue. Nov 26th, 2024

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xMEMS Labs announces first all-silicon active fan-on-a-chip for mobile devices

By Aug 21, 2024

A leader in piezoMEMS technology has announced the first active cooling fan-on-a-chip for use in smartphones, tablets, and other ultraportable devices.

A leader in piezoMEMS technology has announced the first active cooling fan-on-a-chip for use in smartphones, tablets, and other ultraportable devices.

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New

Intel and U.S. ink funding contract — $7.86 billion under the CHIPS Act, $3 billion from Pentagon

New

Adata XPG debuts two-click reversible, magnetic Hurricane Mag case fans — power six fans off one cable

New

Arctic’s new 8,000 RPM case fans blow a pile of boxes off a table from about 10 feet away — Arctic S12038-8K screams like an air raid siren

New

China now producing its own blank wafers as domestic memory company ramps up 3D NAND production — YMTC consumes 500,000 homegrown wafers per month