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Tue. Jan 21st, 2025
New

A new PCB design can boost heat dissipation by 55x – copper coins placed under heat generating components drop temps drastically

By Dec 15, 2024

OKI Circuit Technology has announced a new printed circuit board (PCB) design that can boost component heat dissipation by up to 55x. 

OKI Circuit Technology has announced a new printed circuit board (PCB) design that can boost component heat dissipation by up to 55x. 

By

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