White House urges developers to avoid C and C++, use ‘memory-safe’ programming languages
Biden administration urges developers to use memory-safe programming languages to safeguard against future cybersecurity incidents Biden administration urges…
Best Laser Cutters and Engravers 2024
We help you find the best laser cutters for engraving hobby projects or starting a small business. We…
How to Control your Raspberry Pi Camera using a web UI
Take full control of your Raspberry Pi camera module with this simple to install, and easy to use…
Best Budget 3D Printers 2024: High-Quality Output on the Cheap
These are the best cheap FDM and Resin 3D Printers we’ve tested. These are the best cheap FDM…
Popular PC monitoring tool HWInfo64 can now show FPS and more with onscreen display — full-featured CPU, GPU and system monitoring in new OSD
Popular hardware monitoring program HWInfo64’s new beta has a new in-game OSD (and is also dropping Windows XP…
IBM’s new cloud AI enabled SSDs identify and treat ransomware in under a minute
IBM uses AI-enhanced FlashCore Module (FCM) technology to increase data resilience against cyberattacks by detecting and addressing malware…
TSMC founder says unnamed customers want 10 new fabs to build AI chips
AI processor developers reportedly asking TSMC to significantly boost spending on new fabs as they struggle to meet…
TinyBox packs a punch with six of AMD’s fastest gaming GPUs repurposed for AI — new box uses Radeon 7900 XTX and retails for $15K, now in production
Tiny Corp. offers TinyBox with six Radeon RX 7900 XTX for AI workloads for $15,000. Tiny Corp. offers…
Applied Materials receives multiple subpoenas from U.S government agencies over shipments to China
Leading U.S. wafer fab equipment maker under investigation for supplying fab tools to Chinese chipmakers. Leading U.S. wafer…
$300 million of CHIPS Act R&D funds is officially up for grabs as U.S Department of Commerce opens applications for packaging technology
The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.…