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Wed. Nov 27th, 2024
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SK hynix says its 3D DRAM is half as expensive to produce — credits EUV chipmaking tools

By Aug 16, 2024

SK hynix says adopting 4F2 structures and 3D transistors will increase the cost-efficiency of EUV lithography usage in DRAM production. 

SK hynix says adopting 4F2 structures and 3D transistors will increase the cost-efficiency of EUV lithography usage in DRAM production. 

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