TSMC’s N2 fabrication process shrinks SRAM bit cell size, increases SRAM density to ~38 Mb/mm^2. TSMC’s N2 fabrication process shrinks SRAM bit cell size, increases SRAM density to ~38 Mb/mm^2. Post navigation One EUV chipmaking tool consumes as much power as a small city — EUV fabs to consume 54,000 Gigawatts by 2030, more than Singapore AMD’s gaming-optimized Ryzen 7 9800X3D rumored to cost $479 — $30 price bump over prior-gen Ryzen 7 7800X3D