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Sat. Sep 21st, 2024
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TSMC explores using 510×515 mm rectangular silicon wafers — tripling the usable area of current 300mm diameter tech

By Jun 20, 2024

Nikkei says TSMC is researching rectangular substrates for advanced chip packaging. 

Nikkei says TSMC is researching rectangular substrates for advanced chip packaging. 

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New

Microsoft now allows you to reprogram the Windows Copilot key, but there’s a catch

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Qualcomm approached Intel about acquisition, report claims

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RX 7800M-powered OneXGPU2 eGPU hits crowdfunding next week with an $839 early bird price

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Some analysts believe Intel won’t build out its German fab due to financial woes: Report