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Tue. Nov 26th, 2024
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UCIe 2.0 specifications standardize management architecture and 3D packaging across different chiplets

By Aug 7, 2024

UCIe specification reaches version 2.0, gets interoperability architecture for multi-vendor chiplets and 3D packaging support optimized for hybrid bonding and bump pitches. 

UCIe specification reaches version 2.0, gets interoperability architecture for multi-vendor chiplets and 3D packaging support optimized for hybrid bonding and bump pitches. 

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