SK Hynix gets $458 million from the U.S. government via the CHIPS Act to build an HBM packaging plant in Indiana.
SK Hynix gets $458 million from the U.S. government via the CHIPS Act to build an HBM packaging plant in Indiana.
US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant — plans to lend an additional $500 million for Lafayette project
