Probenchmark

#Go Pro

Fri. Sep 20th, 2024
New

US to boost chip packaging capacity with CHIPS Act grant — Amkor to receive $600 million for advanced chip packaging facility

By Jul 26, 2024

Amkor gets $600 in grants and loans to build an advanced packaging facility in Arizona that will support TSMC’s fab in the state. 

Amkor gets $600 in grants and loans to build an advanced packaging facility in Arizona that will support TSMC’s fab in the state. 

By

Related Post

New

RX 7800M-powered OneXGPU2 eGPU hits crowdfunding next week with an $839 early bird price

Sep 20, 2024
New

Some analysts believe Intel won’t build out its German fab due to financial woes: Report

Sep 20, 2024
New

Microsoft inks deal to restart Three Mile Island nuclear reactor to fuel its voracious AI ambitions

Sep 20, 2024

Leave a Reply

Your email address will not be published. Required fields are marked *

You Missed

New

RX 7800M-powered OneXGPU2 eGPU hits crowdfunding next week with an $839 early bird price

New

Some analysts believe Intel won’t build out its German fab due to financial woes: Report

New

Microsoft inks deal to restart Three Mile Island nuclear reactor to fuel its voracious AI ambitions

New

Intel Optane 905P 1.5TB SSD goes on sale for $299