Probenchmark

#Go Pro

Tue. Nov 26th, 2024
New

US to boost chip packaging capacity with CHIPS Act grant — Amkor to receive $600 million for advanced chip packaging facility

By Jul 26, 2024

Amkor gets $600 in grants and loans to build an advanced packaging facility in Arizona that will support TSMC’s fab in the state. 

Amkor gets $600 in grants and loans to build an advanced packaging facility in Arizona that will support TSMC’s fab in the state. 

By

Related Post

New

US to reportedly sanction 200 more Chinese chip firms — high bandwidth memory might also see export bans

Nov 25, 2024
New

World’s first Ryzen AI 300-powered gaming handheld presale stretches up to $1,699 — flagship OneXFly F1 Pro sports Ryzen AI 9 HX 370, 64GB RAM, and 4TB SSD

Nov 25, 2024
New

Core Ultra 5 225F barely outperforms Core i5-13600 in Geekbench — low-end Ultra 5 chip comes with six P-core and four E-cores

Nov 25, 2024

Leave a Reply

Your email address will not be published. Required fields are marked *

You Missed

New

US to reportedly sanction 200 more Chinese chip firms — high bandwidth memory might also see export bans

New

World’s first Ryzen AI 300-powered gaming handheld presale stretches up to $1,699 — flagship OneXFly F1 Pro sports Ryzen AI 9 HX 370, 64GB RAM, and 4TB SSD

New

Core Ultra 5 225F barely outperforms Core i5-13600 in Geekbench — low-end Ultra 5 chip comes with six P-core and four E-cores

New

Teamgroup unveils 16TB external SSD with speeds up to 1.8 GB/s — T-CREATE EXPERT P32 stores up to 672 minutes of 4K 120 FPS N-RAW video files